808-AG11D
CONN IC DIP SOCKET 8POS GOLD
808-AG11D Specifications
Part Status：
Obsolete
Mounting Type：
Through Hole
Operating Temperature：
-55°C ~ 105°C
Pitch - Mating：
0.100" (2.54mm)
Contact Finish - Mating：
Gold
Pitch - Post：
0.100" (2.54mm)
Contact Finish - Post：
Tin-Lead
Material Flammability Rating：
UL94 V-0
Termination：
Solder
Type：
DIP, 0.3" (7.62mm) Row Spacing
Features：
Open Frame
Termination Post Length：
0.125" (3.18mm)
Number of Positions or Pins (Grid)：
8 (2 x 4)
Housing Material：
Polyester
Contact Resistance：
10mOhm
Contact Finish Thickness - Post：
80.0µin (2.03µm)
Contact Material - Mating：
Copper Alloy
Contact Material - Post：
Copper Alloy
Contact Finish Thickness - Mating：
25.0µin (0.63µm)
